SMD stencils are thin metal foils whose openings reflect the layout of components on a printed circuit board. These openings are optimized by us in advance and after consultation with the customer.
The solder paste is printed onto the pads of the PCB using stencil printing. To do this, the SMD stencil is placed precisely on the PCB and aligned. After the squeegee process and the defined separation of the SMD stencil, the paste deposits remain on the pads of the PCB.
The board is now ready for SMD assembly.
SMD stencils are therefore perfect for applying solder paste to targeted areas of the bare (e.g. tin-plated, gold-plated, etc.) PCB to ensure a complete electrical connection of the solder joints between pads and components.
In our continuing topic series you will learn more about the different types of SMD stencils.