Possibly record-breaking innovation:

At this year's SMT Hybrid Packaging BECKTRONIC presents the first innovative solution for solder paste printing for the year 2017 and breaks industry records as a pioneer. The specialist for SMD stencils and functional accessories for the assembly of printed circuit boards is further evolving the classic maxi stencil and develops a next generation with a strong future. With a total length of 2.5 metres, the BECmax sets new standards and at the same time becomes a symbol of state-of-the-art machine power, maximum competence and productivity. With this innovation BECKTRONIC hits the nerve of time and offers new possibilities in PCB production.

Within microelectronics, efficiency, effectiveness and quality are just as decisive for success as requirement-specific solutions. Special applications require atypical, unique product solutions, such as oversized stencils. Whether for space technology (SpaceTec) or very large LED panels, e.g. for entertainment and event electronics - the further development of the BECmax stencil paves the way for high-precision and cost-efficient pasting of circuit boards for industry-specific special applications.

In line with the upcoming SMT Hybrid Packaging, the company is now revolutionizing the classic maxi stencil BECmax and will unveil the very first prototype exclusively at the trade fair. The exhibit has a size of 2500 mm x 1000 mm and offers a working range of 2000 mm x 600 mm, which is significantly higher than the stencils currently available on the market. With this new generation of oversized stencils, BECKTRONIC demonstrates pioneering spirit and the technological extent of innovative performance. The stencil is unique in its make and also designed for tomorrow's development and production technologies.

"The enlarged, integrated printing area is ideally suited for the precise pasting of continuous circuit boards in a single step. This makes it an excellent alternative to segmented printing processes. In contrast to stencils of conventional size, the subsequent assembly of the individual boards is no longer necessary. This leads to a reduction in effort and costs," explains Thomas Schulte-Brinker, Managing Director of BECKTRONIC GmbH.

The prerequisites for the production of such stencil sizes, in addition to sophisticated adaptations of production parameters, are high-precision machinery as well as distinctive, material-specific know-how. For example, compared to smaller stencils, an increased stretch factor must be taken into account.

As the leading international trade fair for system integration in microelectronics, SMT Hybrid Packaging offers the perfect platform for industry highlights, trends and innovations. From 16 to 18 May in Nuremberg, numerous exhibitors will once again be presenting future-oriented products - from the idea to development and production. Already in the past years BECKTRONIC has set an example with numerous developments and consistently pursues the path of aligning productivity and quality to the requirements of the electronics industry of today and tomorrow. Only in 2015 and 2016 BECKTRONIC GmbH introduced the thinnest and most stable directly bonded precision stencil BECdirectultra. This year the company presents its product highlights in hall 4, booth 126.