Frequently underestimated: The potential of stepped stencils

The requirements for functional SMD stencils for solder paste printing have increased enormously in recent years. Due to the desired high packing density of different electronic components combined on one printed circuit board, different paste volumes have to be generated. However, step stencils can also be used to paste printed circuit boards with coplanarity deviations, thus significantly reducing costs. BECKTRONIC responded to the existing demand with the development of BECstep - step stencils for high-precision results.

Due to the increasing packing density in mixed packing, stepped stencils have become increasingly important in electronics manufacturing. Increasingly, variants with both very small and very large components combined on one printed circuit board are being produced.

The mix of connectors, power and chip components or for example µBGA, QFN and others requires different paste depots. The step technology enables an economical and fast way to generate them. Step stencils also offer the possibility of compensating for coplanarity deviations of printed circuit boards, e.g. due to labelling or a solder resist that is too thick.

The step stencil is also a useful tool for pin-in-paste technology: Where overprinting no longer leads to the desired result, additive step surfaces are the method of choice. The step stencil thus contributes significantly to an economical process. Since a large number of design guidelines have to be taken into account and have to be adapted to the pad pattern and squeegee and soldering process on a case-by-case basis, BECKTRONIC has aligned itself accordingly: The company produces stencils in step design with up to three material thicknesses. As an innovative manufacturer, BECKTRONIC offers both etched and milled stencils in order to be able to react flexibly to individual customer requirements.

Before the stencil is manufactured, a design rule check and optimisation of the step areas are carried out. Depending on the layout, the stencil blank is manufactured using milling or etching technology before it is subjected to further production steps such as laser cutting, engraving and finishing treatments. A technical comparison, extensive consultation and a close exchange with the customer are integral parts of the business relationship. Thus, BECKTRONIC is always very close to its customers, their production conditions and parameters. During the production of the step stencils, particular emphasis is placed on "squeegee-friendly" step transitions for the stencils to convince in use and deliver perfect results.

Thomas Schulte-Brinker, Managing Director of BECKTRONIC, assures: "In our opinion, the most important thing in a business relationship is to work in partnership: We want to offer our customers real added value. In addition to the rapid implementation of our quality stencils, the focus is above all on comprehensive consulting. Because with our know-how we can sensitize our customers to new possibilities and thus help them to a more effective production".