![[Translate to Englisch:] rechteckige BECdirektultra](/fileadmin/user_upload/06-aktuelles/150503_BECdirectultra.jpg)
The thinnest and most stable directly bonded high-precision stencil currently available on the market is now also available in the size 736mm x 584mm. All advantages of this stencil type are now also available with an enlarged printing area.
BECdirectultra scores with EMS companies and OEMs alike, because it offers a multitude of advantages.
The best possible surface tension of > 50 N/cm² forms the perfect basis for sharp printing results even with the finest structures:
- Significantly lower profile height (10 mm) compared to classic frames
- enlarged squeegee area of 676 mm x 524 mm
- Suitable for solder paste and adhesive printing as well as LTCC applications
- no additional clamping frame required, the stencil can be used as it is in the printer, parallel to existing systems
- multiple reusability of the flat profile frame
With the new 736mm x 584mm format, Becktronic meets the requirements of the market. "So far we have manufactured this type of stencil with a frame size of 584mm x 584mm. Shortly after its introduction last year, several companies that generally print with the larger rectangular format approached us and expressed interest in this stencil. It was therefore clear that we wanted to meet this customer request and pushed the further development of the manufacturing process. Now we can also serve this market," declares Claudia Müller, Sales Manager at Becktronic GmbH.
